Product Feature
HVM
Sample/Test
| Product | ~ 2023 | 2024 [New Plant] |
2025 ~ |
|---|---|---|---|
| Layer Count | 2L-14L | 16L ~ | |
| Multilayer | HLC | 1+N+1 | |
| Working Panel | 622mm x 572mm 22.5" X 24.5" |
673mm x 588mm 24" X 28" |
Min Shipping Panel: 80mm / 3" Max Shipping Panel:540mm x 330mm > 596mm x 530mm 21" X 12" > 23" X 20" |
| Min 0.075mm (3mil) Max 2.0mm (80mil) |
Min 0.05mm (2mil) Max 2.0mm (80mil) |
Shipping Panel Thickness: 0.8mm ~ 2.4mm > 0.8mm ~ 4.0mm 3mil ~ 94mil > 3mil ~ 160mil Tolerance: ±10% Main Material: FR4 |
Registration Feature
HVM
Sample/Test
| Product | ~ 2023 | 2024 [New Plant] |
2025 ~ |
|---|---|---|---|
| I/L Trace Width and Space | Inner Layer: 75um / 75um 3mil / 3mil |
Inner Layer: 60um / 60um 2.4mil / 2.4mil |
Inner Layer: 50um / 50um 2mil / 2mil |
| O/L Trace Width and Space | Outer Layer: 75um / 75um 3mil / 3mil |
Outer Layer: 75um / 60um 3mil / 2.4mil |
0.5oz/18um: 60um / 60um 2.4mil / 2.4mil |
Drilling Capability
HVM
Sample/Test
| Product | ~ 2023 | 2024 [New Plant] |
2025 ~ |
|---|---|---|---|
| Press Fit Tolerance | |||
| ± 0.08um | ± 0.05mm ± 2.0mil |
|
|
| Back Drill | + 0mil - mil |
 |
| Parameter | Specification | Remarks | |
|---|---|---|---|
| Press Fit Tolerance | |||
| Min FHS (D) | Min FHS (D) | Accuracy: ± 3mil ( CCD ) | |
| Min DHS (D)* | 8mil / 0.26mm | ||
| Min Ring (B) | d + 8mil / 0.26mm | ||
| Min AntiPad (C) | d + 18mil / 0.55mm | ||
| Back Drill | BDHS (E) | d + 6mil / 0.20mm (CCD) | |
| Stub Length (G) | 6 ± 4mil / 0.12mm | ||
| Clearance | d + 18mil / 0.55mm (CCD) ( Vacuum Plugging ) |
||
Plating Capability
HVM
Sample/Test
| Product | ~ 2023 | 2024 [New Plant] |
2025 ~ |
|---|---|---|---|
| A/R of Through Holes | A/R: 8 | A/R: 16 | |
| VIPPO (Via In Pad Plate Over) |
Solder Mask / Legend Capability
HVM
Sample/Test
| Product | ~ 2023 | 2024 | 2025 ~ [New Plant] |
|---|---|---|---|
| SM Registration | 50um / 2 mil |
|
Impedance Control Capability
HVM
Sample/Test
| Product | ~ 2023 | 2024 | 2025 ~ [New Plant] |
|---|---|---|---|
| Impedance Control | Inner Layer: <10% | Inner Layer: <7% | |
| Outer Layer: <10% |
| Impedance ±10% Roadmap | Impedance ±7% Roadmap | ||
|---|---|---|---|
| Impedance Details | Control Parameters | Control Parameters | |
 |
Significant Factor's 1. Dielectric Constant 2. Thickness (h) 3. Trace Width (W) 4. Trace Copper Thickness (t) |
|
|
Surface Finishing
| Product | ~ 2023 | 2024 [New Plant] |
2025 ~ | |||||
|---|---|---|---|---|---|---|---|---|
| Old / New Building | Old / New Building | Old / New Building | ||||||
| Metal Finishing | OSP | 🗸 | Old | 🗸 | New | 🗸 | New | |
| HASL | 🗸 | Old | 🗸 | 🗸 | ||||
| LF HASL | Old | 🗸 | Old | 🗸 | 🗸 | |||
| GOLD PLATING | Evaluation | Evaluation | New | 🗸 | New | |||
| GOLD PLATING | Evaluation | Evaluation | New | 🗸 | New | |||
| GOLD PLATING | Evaluation | Evaluation | 🗸 | New | ||||
| Remark | LEAD FREE HASL | |
|---|---|---|
| 🗸 | Existing |
|
| Evaluation | Initial Evaluation | |
| 🗸 | New Investment | |
Material Preference
Certified
On Progress
PSA Certified
| Material Type | Nanya | Panasonic | TUC | EMC | Kingboard | Sheng Yi | ITQ | GRACE | ||
|---|---|---|---|---|---|---|---|---|---|---|
| FR4 | Mid-Tg | Non-HF | NP-140TL FR-486 |
R-1766 | TU-662 | - | KB-6164F KB-6060F |
- | - | - |
| Mid-Tg | Non-HF (Low CTE) |
NP-155F NP-155FBH |
R-1755E R-1755M |
TU-662 | EM-825 EM-825(I) |
KB-6165F | S-1000 | IT-158TC | GA-150LL | |
| Mid-Tg | HF | NPG-151 | R-1566 | TU-747HF | EM-285 EM-370(5) |
- | S-1150G | IT-150GTC | GA-HF-15 | |
| High-Tg | Non-HF | NP-175FTL NP-175FBH |
- | - | EM-827(I) | - | - | IT-180T | GA-170LL | |
| High-Tg Mid Loss | HF 0.01-0.012 |
NPG-171 | - | TU-862HF | EM-370(D) | - | - | - | GA-LD-HF | |
| Low Loss | - | NPG-170D | - | TU-872LK | EM-888 | - | - | IT-150DA | - | |